W25Q256JVEIQ
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W25Q256JVEIQ

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Winbond W25Q256JVEIQ is a 256Mbit SPI NOR Flash in 8-pin SOIC-208mil, supporting Dual/Quad SPI and QPI at 3.3V.

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20,000

Specifications

Package: 8-pin SOIC-208mil
Core: SPI NOR Flash
Memory: 256Mbit (32MB)
Interface: SPI/Dual SPI/Quad SPI/QPI
Voltage: 2.7V-3.6V
Clock: 133MHz
Temperature: -40°C to +85°C

Description

The W25Q256JVEIQ from Winbond Electronics is a high-capacity SPI NOR Flash memory device designed for applications requiring reliable code storage and data retention. With a density of 256 megabits (32 megabytes), this device provides ample space for firmware, configuration data, and file systems.

Key Features

  • Memory density: 256Mbit (32MB)
  • Interface: Standard SPI, Dual SPI, Quad SPI, and QPI modes
  • Package: 8-pin SOIC (208-mil) for compact PCB designs
  • Supply voltage: 2.7V to 3.6V, suitable for 3.3V systems
  • Operating temperature range: -40°C to +85°C (industrial grade)
  • High-speed clock frequency: up to 133MHz
  • Flexible erase and program capabilities with sector, block, and chip erase
  • Low power consumption for battery-powered devices

Applications

  • Embedded systems and IoT devices
  • Consumer electronics (smart TVs, set-top boxes)
  • Networking equipment (routers, switches)
  • Industrial control and automation
  • Automotive electronics (infotainment, telematics)
  • Medical devices and wearable technology

Selection Guidance

When selecting the W25Q25Q256JVEIQ, consider the required memory density, interface compatibility, and operating voltage. The device's SOIC-208mil package is suitable for standard PCB assembly. For high-speed applications, verify the maximum clock frequency with the official datasheet. This product is a drop-in replacement for many standard SPI NOR Flash devices with similar pinouts, but always confirm the exact specifications with the manufacturer.